Wireless and  Bluetooth earphones chips types 2021 review:

1, CSR-UK (owned by Qualcomm)
1) Market share: about 15%
2) Common chip model:
Bluetooth 4.1 single mode: CSR8615、CSR8635、CSR8645
Bluetooth 5.0 double mode: CSR8615、CSR8635、CSR8645
3) The latest product models launched in 2019:
Bluetooth 5.0 double mode: QCC510X series:QCC5120、QCC5121;
Bluetooth 5.0 double mode: QCC30XX series:QCC3001、QCC3002、QCC3020、QCC3026, QCC3040
4) Product features: Applied to the pure Bluetooth headphones market. it requires external flash or EEPROM to support the unique APTX lossless format. Bluetooth transmission performance is stable. Low power consumption, good sound quality, long-distance, good customer reputation.
5) Market positioning and customer groups: High-end Bluetooth headset market.

2, Airoha Technology Co., Ltd.-Taiwan (under MediaTek)
1) Market share: about 3%
2) Common chip model:
AB1526、AB1522S、AB1523S、AB1511、AB1512、AB1522S、 AB1523S 、AB1526、 AB1510G、AB1511G、AB1512G、AB1513G;
3) The latest product models launched in 2019:
Bluetooth 5.0 double mode: AB1532、AB1536、AB1562
4) Product features: Applied to the pure Bluetooth headphones market. Low power consumption, good sound quality. Support 1 tray 2 functions, TWS function. built-in FLASH; simple development, no open SDK, only PC-side host computer tools.
5) Market positioning and customer groups: Mid-to-high-end Bluetooth headset market.

3, Realtek Semiconductor-Taiwan
1) Market share: about 10%
2) Common chip model:
Bluetooth 5.1double mode: RTL8763B、RTL8763BA etc
3) The latest product models launched in 2019:
Bluetooth 5.1 double mode: RTL8773B
4) Product features: Applied to the pure Bluetooth headphones market. Low power consumption, good sound quality. Support 1 tray 2 function, TWS function. built-in FLASH; simple development, no open SDK, only PC-side host computer tools.
5) Market positioning and customer groups: Mid-to-high-end Bluetooth headset market.

4, Jerry Technology Co., Ltd.-Zhuhai, Guangdong
1) Market share: about 40%
2) Common chip model:
Bluetooth 5.1double mode: AC6936D、AC6932A、AC6939B、AI8001、AI8006 ect
3) The latest product models launched in 2019:
Bluetooth 5.1 double mode: AC693N series:AC6936D、AC6932A、AC6939B etc
Bluetooth 5.1 double mode: AI800X series:AI8001、AI8006B、AI8006C etc
4) Product features: SOC all-in-one Bluetooth chip, internal integration of MCU, flash, DSP, PMU, and other modules. Support 1 pallet 2 functions, TWS function. ultra-low power consumption 6mA, long-distance, stable performance. mini package QFN 3*2.5, no delay Master-slave switching. Bilateral calls, lossless music format, OTA upgrade, minimal peripherals, smart charging warehouse.
5) Market positioning and customer groups: Mid-end Bluetooth headset market.

5, Bestechnic Technology Co., Ltd. (Wind Tunnel)-Shanghai
1) Market share: about 8%
2) Common chip model:
4.2 Bluetooth BES series: BES2000L、BES2000T、BES2000S、BES2300 etc
5.0 Bluetooth BES series: BES3000 etc
4.2 Bluetooth WT series: WT200M、WT200S、WT200T etc
3) The latest product models launched in 2019: NO
4) Product features SOC all-in-one Bluetooth chip, Bestechnic (BES): low power consumption, good sound quality.
Wind tunnel (WT): The power consumption is too large, and the main TWS mid-to-low-end headphones are promoted. The smallest package QFN40 6*6.
5) Market positioning and customer groups: 
BES: Mid-to-high-end Bluetooth headset market
WT: Mid-to-low-end Bluetooth headset market

6, PixArt Technology -Taiwan
1) Market share: about 3%
2) Common chip model:
5.1 Bluetooth double model: PAU1606、PAU1603 etc
3) The latest product models launched in 2019: PAU1606、PAU1603
4) Product features: 
SOC all-in-one Bluetooth chip, PAU16XX series internal integration of MCU, FLASH, and other modules. Low power consumption, support for master-slave switching without delay. Bilateral calls, good sound quality.
5) Market positioning and customer groups: 
Mid-to-high-end Bluetooth headset market

7, Beken Corporation
1) Market share: about 4%
2) Common chip model:
4.2 Bluetooth single model : BK3254(QFN32),BK3260(QFN32),BK3266(SOP16)、BK3266(QFN32)、BK3266(QFN40)
3) The latest product models launched in 2019: 
  No have
4) Product features: 
SOC all-in-one Bluetooth chip, internal integration of MCU, FLASH, PMU, and other modules. Slightly larger noise floor, long-distance, stable performance, minimum package QFN4*4.
5) Market positioning and customer groups: 
Low-end Bluetooth headset market, gift market, central control headset

8, Actions Technology (Actions)-Zhuhai, Guangdong
1) Market share: about 3%
2) Common chip model: ATS3001、ATS3003、ATS3005、ATS3007
3) The latest product models launched in 2019: ATS3005、ATS3007
4) Product features: 
SOC all-in-one Bluetooth chip, high power consumption, good sound quality.
5) Market positioning and customer groups: 
Mid-end Bluetooth headset market

9,  Unisoc (Shanghai) Technologies Co., Ltd
1) Market share: about 1%
2) Common chip model: IVY5882
3) The latest product models launched in 2019:  NO
4) Product features: 
SOC all-in-one Bluetooth chip, internal integration of MCU, FLASH, PMU, and other modules, power consumption is too large.
5) Market positioning and customer groups: Mid-lower end Bluetooth headset market

True Wireless Earbuds with Charging Case U9

New Qualcomm QCC3020 Wireless Earphones Earbuds M2

True Wireless in-ear Headphones with Smart Ambient G09

Wireless Headphones Bluetooth 5.2 Earbuds B3

V5.0 Bluetooth Stereo Earphones 2800mAh Battery LED Display I09

True Wireless Earphones, Speaker, Power bank All In One 9103

In-ear Sports Headphones G08